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Hardware Specifications

Product Model

Product ModelDescription
NE5038-PX4Hailo15H + eMMC 64GB + LPDDR4 8GB, AF 4X Zoom

NE503 Hardware Block Diagram

NE503 adopts a core processing board (Hailo15H) and AI-PC interface board (STM32G0B0RET6) dual-board architecture, interconnected via board-to-board connectors. The core processing board hosts the SoC, NPU, memory, storage, and imaging subsystems; the AI-PC interface board integrates an independent MCU to manage external IO, power, and peripheral control.

Chip-Level Specifications

The main component parameters of the NE503 core processing board and AI-PC interface board are as follows:

TypeChip ModelSpecifications
CPU / SoCHailo-15HQuad-core Arm Cortex-A53, 1.3 GHz; AI performance up to 20 TOPS; ISP supports up to 12 MP resolution, 600 Mpixel/s pixel rate, HDR and noise reduction; VPU supports H.265/H.264 encoding
DDR4MT53E2G32D4DE-046 WT:C8 GB LPDDR4, 266 Mb/s, 8.5 GB/s single-channel bandwidth
eMMCSDINBDA6-64G-H64 GB eMMC
QSPI FlashIS25WP064D-JKLE8 MB, Quad SPI protocol, standby current 8 µA, erase cycles > 100,000
Temperature SensorTMP1075DSGR12-bit resolution, 0.0625°C, I2C interface
EEPROMAT24C02D2 Kb (256 × 8), I2C interface, standby current < 1 µA, 1,000,000 write cycles
Image SensorIMX678-AAQR1-C1/1.8-inch 4K CMOS image sensor, up to 60fps 4K full-pixel output
PCIe Clock GeneratorPI6CG1820125 MHz, full-output operating current (IDD) 15 mA, low jitter PCIe Gen4: 0.3 ps
Ethernet PHYLAN8720AI10/100M Ethernet PHY, IO voltage 1.6V ~ 3.6V
Inertial Measurement Unit (IMU)LSM6DSRIntegrated 3-axis digital accelerometer (programmable, max ±16 g) and 3-axis digital gyroscope (up to ±4000 dps)
Operating EnvironmentIndoor: -30 ~ 60°C, 0 ~ 95% non-condensing

Version History

VersionDateChanges
V1.02026-04-02Initial release