Core Board
The core processing board hosts the Hailo15H SoC, NPU, memory, and storage subsystems. It connects to the interface board via Board-to-Board Connectors, exposing native SoC high-speed interfaces and expansion pins. This document describes the hardware resources and pin definitions from a chip-level perspective.
Hardware Resource Overview
NE503 consists of the following physical modules:
| Module | Main Chip | Description |
|---|---|---|
| Core Processing Board | Hailo15H SoC | SoC, NPU, memory, storage, I2C sensors, PCIe clock, Ethernet PHY |
| Interface Board | STM32G0B0RET6 | MCU managing external IO, power, and peripheral control; TF card slot on board (see Interface Board) |
| Sensor Board | IMX678-AAQR1-C | 4K CMOS image sensor, connected via FPC connector |
| Light Board | — | Dual-light board (white/red PWM) + IR light board (near/far-IR PWM) |
| Lens Module | SKU-dependent | Selectable AF Lens (44.5° HFOV) or Motorized Zoom (110° HFOV); the driver device and controls depend on the configuration |
The core board and interface board are interconnected via board-to-board connectors: the core board provides native SoC pins, and devices on the interface board are connected to these pins through the connectors.
Download NE503 Hardware Block Diagram
Interface Overview
Core board resources are divided into two categories by physical location:
On-Board Resources — Physically soldered on the core processing board:
| # | Function | Chip Model | Category |
|---|---|---|---|
| 1 | LPDDR4 | 4 GB / 8 GB (configuration-dependent device) | SoC built-in |
| 2 | eMMC | SDINBDA6-64G-H | SoC built-in |
| 3 | QSPI Flash | IS25WP064D-JKLE | SoC built-in |
| 4 | Temperature Sensor | TMP1075DSGR | On-board I2C |
| 5 | Gyroscope | LSM6DSR | On-board I2C |
| 6 | EEPROM | AT24C02D | On-board I2C |
| 7 | PCIe Clock | PI6CG18201 | On-board I2C |
| 8 | PCIe & USB | Hailo15H built-in | SoC high-speed |
| 9 | Ethernet PHY | LAN8720AI | On-board RMII |
Expansion Resources — Physically located on the interface board or external modules, connected through core board connector pins:
| # | Function | Chip/Module | Connection | Category |
|---|---|---|---|---|
| 10 | Image Sensor | IMX678-AAQR1-C | MIPI CSI-2 + I2C0 | Internal |
| 11 | TF Card | — | SDIO0 + GPIO | Product |
| 12 | Debug UART | — | UART0 | Debug |
| 13 | BOOT Mode | — | BOOT0/BOOT1 | Debug |
| 14 | Lens Driver | Lens-configuration dependent | SPI (CS1) | Internal |
| 15 | Audio Codec | NAU88C10 | I2S + I2C0 | Internal |
| 16 | Radar Module | — | UART2 + GPIO | Internal |
| 17 | MCU Reset Control | SN74LVC1G14DCK | GPIO | Internal |
SoC Built-in Resources
The following resources are directly connected via native SoC interfaces and physically soldered on the core processing board.
LPDDR4 (documented 8 GB configuration: MT53E2G32D4DE-046 WT:C)
NE503 is available with 4 GB or 8 GB LPDDR4. The documented 8 GB configuration uses MT53E2G32D4DE-046 WT:C at 4266 Mb/s with 8.5 GB/s single-channel bandwidth; the device model and bandwidth for the 4 GB configuration must follow its BOM.
| Pin | Function |
|---|---|
| DDR_CH0_DQ0 ~ DDR_CH0_DQ15 | Channel 0 data lines |
| DDR_CH1_DQ0 ~ DDR_CH1_DQ15 | Channel 1 data lines |
| DDR_CH0_CA0 ~ DDR_CH0_CA5 | Channel 0 command/address lines |
| DDR_CH1_DQS1N / DDR_CH1_DQS1P | Channel 1 data strobe differential pair |
| DDR_CH0_DQS1N / DDR_CH0_DQS1P | Channel 0 data strobe differential pair |
eMMC (SDINBDA6-64G-H)
64 GB eMMC, connected directly to SoC SDIO1 interface.
| Pin | Function |
|---|---|
| SDIO1_DAT0 | Data line 0 |
| SDIO1_DAT1 | Data line 1 |
| SDIO1_DAT2 | Data line 2 |
| SDIO1_DAT3 | Data line 3 |
| SDIO1_CMD | Command line |
| SDIO1_SDCLK | Clock line |
QSPI Flash (IS25WP064D-JKLE)
8 MB, Quad SPI protocol, connected directly to SoC H_SPI interface.
| Pin | Function |
|---|---|
| H_SPI_DQ0 | FLASH_DQ0 (Data line 0) |
| H_SPI_DQ1 | FLASH_DQ1 (Data line 1) |
| H_SPI_DQ2 | FLASH_DQ2 (Data line 2) |
| H_SPI_DQ3 | FLASH_DQ3 (Data line 3) |
| H_SPI_CLK | FLASH_CLK (Clock) |
| H_SPI_CS0 | FLASH_CS0 (Chip select) |
PCIe & USB
Hailo15H SoC native PCIe Gen4 and USB interfaces. PCIe clock provided by on-board PI6CG18201.
Ethernet PHY (LAN8720AI)
10/100M Ethernet PHY, IO voltage 1.6V ~ 3.6V, connected to SoC via RMII interface, providing wired network communication.
| Pin | Function | Note |
|---|---|---|
| RMII_RXD0 | ETH_RMII_RXD0 | — |
| RMII_RXD1 | ETH_RMII_RXD1 | — |
| RMII_RX_ER | ETH_RMII_RXD2 | SoC pin mux name |
| RMII_CRS_DV | ETH_RMII_RXD3 | SoC pin mux name |
| RX_CLK | ETH_RMII_RX_CLK | RMII reference clock 50 MHz |
| RMII_TXD0 | ETH_RMII_TXD0 | — |
| RMII_TXD1 | ETH_RMII_TXD1 | — |
| RMII_TX_EN | ETH_RMII_TXD2 | SoC pin mux name |
| MDIO | ETH_MDIO | — |
| MDC | ETH_MDC | — |
On-Board I2C Devices
The following I2C devices are physically soldered on the core board, allocated by bus. Devices on the same bus are distinguished by different slave addresses.
| I2C Bus | On-Board Device | Slave Address |
|---|---|---|
| I2C1 | TMP1075 (Temperature Sensor), AT24C02D (EEPROM), PI6CG18201 (PCIe Clock) | 0x49, 0x50, 0x6A |
| I2C2 | LSM6DSR (Gyroscope) | 0x6A |
Note: PI6CG18201 (I2C1, address 0x6A) and LSM6DSR (I2C2, address 0x6A) are on different I2C buses, so there is no address conflict.
I2C0 bus is routed to the interface board via connectors, connecting IMX678 and NAU88C10 (see Expansion Interfaces below).
Temperature Sensor (TMP1075DSGR)
I2C1 slave address 0x49, 12-bit resolution, 0.0625°C.
| Pin | Function |
|---|---|
| H_I2C1_SDA | I2C1 data line |
| H_I2C1_SCL | I2C1 clock line |
Gyroscope (LSM6DSR)
I2C2 slave address 0x6A, integrated 3-axis accelerometer (±16 g) and 3-axis gyroscope (±4000 dps).
| Pin | Function |
|---|---|
| I2C2_SDA | GPIO_6 (I2C2 data line) |
| I2C2_SCL | GPIO_7 (I2C2 clock line) |
EEPROM (AT24C02D)
I2C1 slave address 0x50, 2 Kb (256 × 8), standby current < 1 µA.
| Pin | Function |
|---|---|
| H_I2C1_SDA | I2C1 data line |
| H_I2C1_SCL | I2C1 clock line |
PCIe Clock Generator (PI6CG18201)
I2C1 slave address 0x6A, 25 MHz, PCIe Gen4 low jitter 0.3 ps.
| Pin | Function |
|---|---|
| H_I2C1_SDA | I2C1 data line |
| H_I2C1_SCL | I2C1 clock line |
Expansion Interfaces
The following interfaces are routed through core board connectors. Physical devices are located on the interface board or external modules.
Image Sensor (MIPI CSI-2 + I2C0)
The core board connects to the image sensor via MIPI CSI-2 data lanes and I2C0 control bus. IMX678-AAQR1-C is located on a separate sensor board, connected via FPC connector. I2C0 slave address 0x10.
| Pin | Function |
|---|---|
| CSI0_RX0P ~ CSI0_RX3N | MIPI CSI-2 data lanes (4 Lanes) |
| H_I2C0_SDA | I2C0 data line |
| H_I2C0_SCL | I2C0 clock line |
Lens Driver
The core board SPI bus is routed via CS1 chip select to provide the lens-driver control path. It shares the SPI bus with QSPI Flash and is distinguished by a separate chip select. The board record in this page corresponds to the AN41908A-VBA driver device; the installed lens option, driver device, and autofocus/zoom capabilities must follow the specific SKU, BOM, and firmware. MCU SPI1 handles lens homing and limit protection (see Interface Board).
| Pin | Function |
|---|---|
| H_SPI_DQ0 | FLASH_DQ0 |
| H_SPI_DQ1 | FLASH_DQ1 |
| H_SPI_DQ2 | FLASH_DQ2 |
| H_SPI_DQ3 | FLASH_DQ3 |
| H_SPI_CLK | FLASH_CLK |
| H_SPI_CS1 | FLASH_CS1 (Lens driver chip select) |
Note: The function column names FLASH_DQ0 ~ FLASH_DQ3 and FLASH_CLK above come from the SoC QSPI controller pin naming. These pins are connected to the lens driver chip AN41908A via CS1 chip select, sharing the same data and clock lines as the QSPI Flash (CS0), distinguished by different chip select signals.
Audio Codec (I2S + I2C0)
The core board routes audio channels via I2S data interface and I2C0 control bus, connecting to the NAU88C10 audio codec (located on the interface board). I2C0 slave address 0x1A.
| Pin | Function |
|---|---|
| H_I2S_SDI | I2S data input |
| H_I2S_SDO | I2S data output |
| H_I2S_WS | I2S word select |
| H_I2S_SCK | I2S clock |
| H_I2C0_SCL | I2C0 clock line |
| H_I2C0_SDA | I2C0 data line |
UART2 (Radar Module)
Core board UART2 pins routed via connector for external radar module connection. Pins can be multiplexed as GPIO.
| Pin | Function | Note |
|---|---|---|
| H_GPIO_4 | UART2_TX | Can be multiplexed as GPIO |
| H_GPIO_6 | UART2_RX | Can be multiplexed as GPIO, shared with I2C2_SDA |
| SAFETY_FATAL | Safety fault signal | — |
SDIO0 (TF Card)
Core board SDIO0 interface routed via connector to the TF card slot on the interface board, supporting low-speed and high-speed modes.
| Pin | Function |
|---|---|
| H_GPIO_17 | Speed mode control (high = low-speed, low = high-speed) |
| SDIO0_DAT0 | Data line 0 |
| SDIO0_DAT1 | Data line 1 |
| SDIO0_DAT2 | Data line 2 |
| SDIO0_DAT3 | Data line 3 |
| SDIO0_CMD | Command line |
| SDIO0_SDCLK | Clock line |
GPIO (MCU Reset Control)
Core board GPIO18 pin routed via connector to the SN74LVC1G14DCK reset chip for resetting the interface board MCU (STM32G0B0). In the reverse direction, the MCU can also reset the core processing board via PD8 (POWER_RST) (see Interface Board).
| Pin | Function |
|---|---|
| H_GPIO_18 | Reset control (active high) |
Debug Interfaces
The following interfaces are used for system debugging and firmware flashing, with connectors located on the interface board.
UART0 (Debug Serial Port)
SoC native UART0, routed via connector for system debugging. This serial port has a dual role: it serves as the SoC debug serial port for system log output and interactive debugging, and also acts as the primary communication channel between the core processing board and the interface board MCU (STM32G0B0).
| Pin | Function |
|---|---|
| SOC_UART0_RXD | UART0 receive |
| SOC_UART0_TXD | UART0 transmit |
BOOT Mode
SoC boot mode configuration pins, routed via connector.
| Pin | Function |
|---|---|
| BOOT0 | Boot mode select 0 |
| BOOT1 | Boot mode select 1 |
SoC BootMode[0:1] configuration:
| Mode | BOOT[1:0] |
|---|---|
| QSPI Flash | 00 |
| PCIe | 01 |
| UART | 10 |