Components Overview
Product Overview
The NE300-MB01 development board is a low-power wireless camera platform capable of snapshots, video streaming, and onboard visual inference. It uses STMicroelectronics' STM32N657L0H3 (Arm® Cortex®-M33) as the main processor with Wi-Fi 6 and BLE radios. OS04C10 and USB cameras are supported for image capture, and a Cat-1 modem can be added for cellular uplink. The board is ideal for low-power, edge-deployed imaging scenarios that require flexible mounting accessories.
Main Board Overview
The main board integrates the STM32N657L0H3 MCU with 64 MB of external PSRAM and 128 MB of external Flash. An STM32U073KBU6 handles power management and ultra-low-power sleep control. Connectivity is provided by the SiWN917M100LGTBA Wi-Fi 6/BLE 5.4 combo chip. Optional Cat-1 cellular modules and GPIO expansions allow for further customization. The default kit ships with an OS04C10 camera module, while USB camera modules are also available. Highlights:
- Application MCU – STM32N657L0H3 with an Arm® Cortex®-M33 core up to 800 MHz and ST Neural-ART Accelerator (up to 1 GHz, 600 GOPS, 288 MAC/cycle)
- External PSRAM – APS512XX-OBR-BG, 64 MB, up to 250 MHz, 16-bit bus
- External Flash – MX66UM1G45G SPI NAND, 128 MB, up to 200 MHz, 8-bit bus
- Wi-Fi module – SiWN917M100LGTBA with 2.4 GHz Wi-Fi 6 (IEEE 802.11 b/g/n/ax) and Bluetooth 5.4
- Camera modules – OS04C10 CSI-2 module by default, optional USB module
- Capture button – One-touch snapshot trigger
- Indicators – Blue status LED plus a 0.5 W white fill light
- Debug interfaces – ST-Link, USB, and UART headers
- Power kill switch – Slide switch to fully disconnect the battery input
- External sensor ports – Alarm IO, PIR input, and other sensor headers
- Expandable IO – SPI + I2C + UART + SAI (I2S compatible) + general-purpose GPIO
- Modem options – Cat-1 cellular module socket
Camera Module Specifications
- OS04C10 standard module: 2688 × 1520 resolution, 1/4" sensor, lenses with HFOV 59° / 97° / 165°, manual focus.
- USB camera module: Smartsens SC200AI sensor, 1920 × 1080 resolution, 1/2.8" sensor size, multiple FOV lens choices, UVC compliant.
OS04C10 Camera Module
| CMOS Sensor | OS04C10-A43A |
|---|---|
| Optical Format | 1/2.9" |
| Max Resolution | 2688 × 1520 |
| Focal Length | 2.5 mm / 3 mm / 6 mm |
| Interface | CSI-2 |
| DFOV | 59° / 97° / 165° |
| Module Size | 25 × 25 mm |
| Operating Temp | -20 °C ~ 60 °C |
USB Camera Module
| CMOS Sensor | SC200AI |
|---|---|
| Optical Format | 1/2.8" |
| Max Resolution | 1920 × 1080 |
| Focal Length | 2.5 mm / 3 mm / 6 mm |
| Interface | USB (UVC) |
| DFOV | 59° / 97° / 165° |
| Module Size | 25 × 23.86 mm |
| Operating Temp | -20 °C ~ 60 °C |
Cat-1 Module Specifications
The global variant (outside North America) uses Quectel EG912 modules connected over UART.
| Item | EG912 Specs |
|---|---|
| LTE-FDD | B1 / 2 / 3 / 4 / 5 / 7 / 8 / 12 / 13 / 17 / 18 / 19 / 20 / 25 / 26 / 28 / 66 |
| LTE-TDD | B34 / 38 / 39 / 40 / 41 |
| GSM | B2 / 3 / 5 / 8 |
| Antenna | On-board |
| Interfaces | UART, USB |
| Supply Voltage | 4 V – 6 V |
| Operating Temp | -20 °C ~ 60 °C |
| Storage Temp | -40 °C ~ 85 °C |
| Board Size | 60 × 60 mm |
| Certifications | CE |
The North America SKU uses Quectel EG915Q-NA (UART connection).
| Item | EG915 Specs |
|---|---|
| LTE-FDD | B2 / B4 / B5 / B12 / B13 / B14 / B66 / B71 |
| Antenna | On-board |
| Interfaces | UART, USB |
| Supply Voltage | 4 V – 6 V |
| Operating Temp | -20 °C ~ 60 °C |
| Storage Temp | -40 °C ~ 85 °C |
| Board Size | 60 × 60 mm |
| Certifications | FCC |
Accessories & Mounts
Lens Modules
UVC-compliant USB lens module powered by the SC200AI image sensor.
Sensor Modules
Sensors can be attached over DI/DO, RS485, SPI, I2C, UART, SAI, or GPIO—for example PIR sensors.
Wireless Modules
Cat-1 cellular modules.
Mounting Accessories
A variety of flexible mounts are available. See Product Installation.