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Components Overview

Product Overview​

The NE300-MB01 development board is a low-power wireless camera platform capable of snapshots, video streaming, and onboard visual inference. It uses STMicroelectronics' STM32N657L0H3 (Arm® Cortex®-M55) as the main processor with Wi-Fi 6 and BLE radios. OS04C10 and USB cameras are supported for image capture, and a Cat-1 modem can be added for cellular uplink. The board is ideal for low-power, edge-deployed imaging scenarios that require flexible mounting accessories.

Main Board Overview​

The main board integrates the STM32N657L0H3 MCU with 64 MB of external PSRAM and 128 MB of external Flash. V1.1–V1.3 use an STM32U073KBU6 for power management and ultra-low-power sleep control; V1.0 has the initial power architecture and does not include this U0 controller. Connectivity is provided by the SiWN917M100LGTBA Wi-Fi 6/BLE 5.4 combo chip. Optional Cat-1 cellular modules and GPIO expansions allow for further customization. The default kit ships with an OS04C10 camera module, while USB camera modules are also available. Highlights:

  • Application MCU – STM32N657L0H3 with an Arm® Cortex®-M55 core up to 800 MHz and ST Neural-ART Accelerator (up to 1 GHz, 600 GOPS, 288 MAC/cycle)
  • External PSRAM – APS512XX-OBR-BG, 64 MB, up to 250 MHz, 16-bit bus
  • External Flash – MX66UM1G45G SPI NAND, 128 MB, up to 200 MHz, 8-bit bus
  • Wi-Fi module – SiWN917M100LGTBA with 2.4 GHz Wi-Fi 6 (IEEE 802.11 b/g/n/ax) and Bluetooth 5.4
  • Camera modules – OS04C10 CSI-2 module by default, optional USB module
  • Capture button – One-touch snapshot trigger
  • Indicators – Blue status LED plus a 0.5 W white fill light
  • Debug interfaces – ST-Link, USB, and UART headers
  • Power kill switch – Slide switch to fully disconnect the battery input
  • External sensor ports – Alarm IO and other sensor inputs; the dedicated PIR connector is available on V1.3 only and other revisions require checking the interface table
  • Expandable IO – SPI + I2C + UART + SAI (I2S compatible) + general-purpose GPIO
  • Modem options – Cat-1 cellular module socket

Camera Module Specifications​

  • OS04C10 standard module: 2688 × 1520 resolution, 1/4" sensor, lenses with DFOV 59° / 97° / 165°, manual focus.
  • USB camera module: Smartsens SC200AI sensor, 1920 × 1080 resolution, 1/2.8" sensor size, multiple FOV lens choices, UVC compliant.

OS04C10 Camera Module

CMOS SensorOS04C10-A43A
Optical Format1/2.9"
Max Resolution2688 × 1520
Focal Length2.5 mm / 3 mm / 6 mm
InterfaceCSI-2
DFOV59° / 97° / 165°
Module Size25 × 25 mm
Operating Temp-20 °C ~ 60 °C

USB Camera Module

CMOS SensorSC200AI
Optical Format1/2.8"
Max Resolution1920 × 1080
Focal Length2.5 mm / 3 mm / 6 mm
InterfaceUSB (UVC)
DFOV59° / 97° / 165°
Module Size25 × 23.86 mm
Operating Temp-20 °C ~ 60 °C

Cat-1 Module Specifications​

The global variant (outside North America) uses Quectel EG912 modules connected over UART.

ItemEG912 Specs
LTE-FDDB1 / 2 / 3 / 4 / 5 / 7 / 8 / 12 / 13 / 17 / 18 / 19 / 20 / 25 / 26 / 28 / 66
LTE-TDDB34 / 38 / 39 / 40 / 41
GSMB2 / 3 / 5 / 8
AntennaOn-board
InterfacesUART, USB
Supply Voltage4 V – 6 V
Operating Temp-20 °C ~ 60 °C
Storage Temp-40 °C ~ 85 °C
Board Size60 × 60 mm
CertificationsCE

The North America SKU uses Quectel EG915Q-NA (UART connection).

ItemEG915 Specs
LTE-FDDB2 / B4 / B5 / B12 / B13 / B14 / B66 / B71
AntennaOn-board
InterfacesUART, USB
Supply Voltage4 V – 6 V
Operating Temp-20 °C ~ 60 °C
Storage Temp-40 °C ~ 85 °C
Board Size60 × 60 mm
CertificationsFCC

Accessories & Mounts​

Lens Modules​

UVC-compliant USB lens module powered by the SC200AI image sensor.

Sensor Modules​

Sensors can be attached over DI/DO, RS485, SPI, I2C, UART, SAI, or GPIO—for example PIR sensors.

Wireless Modules​

Cat-1 cellular modules.

Mounting Accessories​

A variety of flexible mounts are available. See Product Accessories.